According to reports, Taiwan Semiconductor Manufacturing Company (TSMC) has started the pilot production stage on its 3nm chips process, or N3, at Fab 18 in southern Taiwan. TSMC is going to move to volume production by the end of 2022, should everything go in accordance with a timetable.
According to information provided to DigiTimes by unknown industrial sources (paywalled, through MacRumors), TSMC intends to begin shipping 3nm chips to consumers, including Intel and Apple, at the start of 2023, jives with previous leaks on the subject.
The first 3nm chips from the California-based Cupertino giant are anticipated to ship Macs and iPhones subsequently as the M3 and the A17 Bionic, individually. Last month, the details stated that a couple of Apple M3 chips could pack as many as four dies with up to 40 cores. As a comparison, present-gen M1 Pro and M1 Max chips have 10-core CPUs.
For the time being, there are chances of seeing Macs with M2 chips and iPhone 14 models ship with hardware constructed on TSMN’s N4P process, which is the organization’s third significant improvement to its 5nm process.
According to a statement given by TSMC back in October, N4P is going to supply an 11 percent performance increase over the native N5 technology and a six percent increase over N4. N4P is going to further supply a 22 percent enhancement in power proficiency over N5, we have been informed.
According to other related news, Intel is all set to see TSMC before the end of this month in order to talk about 3nm chip production and production capacities. Intel intends to build a closer relationship with TSMC to prevent fighting with California-based Cupertino giant over the accessible 3nm capacity.